DZ09238-F04
类 型：双滚珠
风 量：90.57~123.50CFM
尺 寸：80x80x38mm
额定电压：12V
重 量：153.0g
DZ08038-F06
类 型：双滚珠
风 量：90.57~123.50CFM
尺 寸：80x80x38mm
额定电压：12V
重 量：153.0g
DZ12038-F05
类 型：双滚珠
风 量：90.57~123.50CFM
尺 寸：80x80x38mm
额定电压：12V
重 量：153.0g
DA04056-F01
类 型：双滚珠
风 量：90.57~123.50CFM
尺 寸：80x80x38mm
额定电压：12V
重 量：153.0g
I2C-Compatible (2-Wire) Serial EEPROM 128-Kbit (16,384 x 8) AT24C128C
Application: LED Drive Power Supply, Medical Power Supply
Features1: Glass Passivated Chip
Features2: Low Forward Voltage Drop
Features3: Ideal for Printed Circuit Board
Features4: High Surge Current Capability
Transport Package: Plastic Package
- Parameters
Application: LED Drive Power Supply, Medical Power Supply
Features1: Glass Passivated Chip
Features2: Low Forward Voltage Drop
Features3: Ideal for Printed Circuit Board
Features4: High Surge Current Capability
Transport Package: Plastic Package
Basic Info.
| Model NO. | AT24C128C | Specification | PDIP/SOIJ/SOIC/TSSOP |
| Origin | Guangdong, China | Production Capacity | 10000 Pieces/Day |
Product Description
The Atmel® AT24C128C provides 131,072-bits of Serial Electrically Erasable and Programmable Read-Only Memory (EEPROM) organized as 16,384 words of 8 bits each. The device's cascading feature allows up to eight devices to share a common 2-wire bus. The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential. The devices are available in space-saving 8-lead JEDEC SOIC, 8-lead TSSOP, 8-pad UDFN, 8-pad XDFN, 8-ball VFBGA, and 4-ball WLCSP packages. In addition, this device operates from 1.7V to 5.5V.
FEATURES
Low-voltage and Standard-voltage Operation
Internally Organized as 16,384 x 8
2-wire Serial Interface
Schmitt Trigger, Filtered Inputs for Noise Suppression
Bidirectional Data Transfer Protocol
400kHz (1.7V) and 1MHz (2.5V, 2.7V, 5.0V) Compatibility
Write Protect Pin for Hardware Protection
Self-timed Write Cycle (5ms Max)
Lead-free/Halogen-free Devices Available
Green Package Options (Pb/Halide-free/RoHS Compliant)
Die Sale Options: Wafer Form, Waffle Pack, and Bumped Wafers
Previous : I2C Automotive Temperature Serial EEPROM 128K (16,384 x 8), 256K (32,768 x 8) AT24C256C IC
Next : Low Noise, Low Drift, Low Power, 3-Axis MEMS Accelerometers ADXL354/ADXL355
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Dongguan Merry Electronic CO., LTD Was established in year of 2013，Mainly engaged in design, development and sales semiconductors...
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